BOARD LEVEL SHIELDS
For low volume or high volume quantities, Border Precision’s in house broad product knowledge based Design and Technical support team are able to provide fast turnaround solutions by using the latest Pro Engineer CAD/CAM packages. Various metals, thicknesses, and plated finishes can be provided on request to ensure optimum EMC performance in suppressing spurious RFI signals.
Metals can be selected from a range of thicknesses, and from a variety of un-plated or pre-plated options for soldering in place. Alternatively, parts may have post-plated protective finishes applied after manufacture where use in severe operating environments requires the very highest electro-chemical galvanic compatibility specifications and shielding levels.
For Prototypes, pilot builds, or low volume quantity production requirements Border Precision’s Board Level Shields are cost effectively produced using our versatile in house Chemical Etching facilities, allowing CAD data to be used to build up part profiles quickly, enabling project designs to be approved prior to any high investment hard tooling being commissioned. Any required changes can be easily incorporated - at minimal costs.
For higher volume quantities dedicated hard tooling stamping & forming suites are designed and produced using Border Precision’s in house fully equipped tool making facilities, ensuring maximum control of the manufacture of all tooling and parts to the highest quality levels.
Board Level Shields are available in either one piece or two-piece variety; the latter allows service access to components after the soldering operation by removing the reusable cover.
Board Level shields are plated finished to allow soldering to Printed Circuit Boards, or to suit your requirements.
Packaging formats available range from parts individually wrapped and packed, through to loose packed parts, or in tape and reel for automatic ‘pick & place’.
Board Level shields are used to reduce both unwanted radiated emissions from components emitting spurious (bi-product) signals. These occurrences are frequently experienced with computing (and similar) processors chip sets. These are usually referred to as ‘noisy’ components. The spurious signals can affect the performance of other components nearby, causing circuits to work erratically, or even fail.
By surrounding the noisy component with its own (Board Level) shield, which is grounded to the printed circuit board, a Faraday cage is produced around the component protecting other components from being affected by its spuriously radiated signals, while simultaneously protecting it from being susceptible to spurious signals from outside sources, acting as a control for signals travelling towards or from that component.
As clock speeds of processors and other board chip sets increase the likelihood of requiring Board Level shields increase too. Board Level shields may also incorporate very small holes, small enough to allow out gassing when soldered and allow some thermal dissipation from components – without affecting the shielding effectiveness of the shielding can.
Board Level Shields are commonly used in Products where transmitting and receiving signals occurs, such as:
- Network Basestations
- Broadcasting RF circuitry
- Broadband Systems
- Telecommunications Systems
- Mobile Phones, PDA's and Blackberry's